Intel® Xeon® Bloomfield Quad Core Processor W3570, 3.2GHz, 8M, QPI 6.4 GT/sec, LGA1366
Ngày cập nhật: 21/02/2011
Intel® Xeon® Quad Core Processor W3570, 3.2GHz, 8M, QPI 6.4 GT/sec, LGA1366
| General information |
| Type |
CPU / Microprocessor |
| Family |
Intel Xeon |
Model number
|
W3570 |
| CPU part number |
AT80601000918AB (SLBES) |
| Box part number |
BX80601W3570 |
| Frequency (MHz) |
3200 |
Bus speed (MHz)
|
3200 MHz QPI |
| Package |
1366-land Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm) |
| Socket |
Socket 1366 (LGA1366) |
| |
| Architecture / Microarchitecture |
| Processor core |
Nehalem-WS |
| Core stepping |
D0 (SLBES) |
| Manufacturing process |
0.045 micron |
| Data width |
64 bit |
| Number of cores |
4 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
4 x 32 KB instruction caches
4 x 32 KB data caches |
| Level 2 cache size |
4 x 256 KB |
| Level 3 cache size |
8 MB |
| Physical memory (GB) |
24 |
| Multiprocessing |
Uniprocessor |
| Features |
- MMX instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1
- SSE4.2
- EM64T technology
- Virtualization technology
- Execute Disable bit
- Turbo Boost Technology
- Hyper-Threading technology
|
| Low power features |
- Thread C1/C1E, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology
|
| On-chip peripherals |
- Integrated 3-channel DDR3 SDRAM Memory controller
- Quick Path Interconnect
|
| |
| Electrical/Thermal parameters |
| V core (V) |
0.8 - 1.375 |
| Minimum/Maximum operating temperature (°C) |
5 - 67.9 |
| Minimum/Maximum power dissipation (W) |
12 (TDP in C6 state) / 224.42 |
| Thermal Design Power (W) |
130 |
| |
| Notes on Intel AT80601000918AB |
- Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory
|
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